Enabling Hermetic Solutions with Microelectronics Technology
At last, a complete solution for harsh environment microelectronic companies. Hermetic Solutions Group is comprised of four leading hermetic packaging and component manufacturers.
At last, a complete hermetic solution for harsh environment microelectronics companies. We offer turn-key packaging, enabling hermetic components and integration & final sealing.
"Integration and Final Sealing"
Using technologies such as Kryoflex® polycrystalline ceramic and explosively bonded metals, we design and manufacture hermetic DC and RF/microwave connectors for extreme environments.
Custom hermetic electronic packages that help companies reduce weight, manage thermal issues and reduce the size of their mission critical, hermetic modules.
Securing Hermeticity in High Reliability Microelectronic Devices
Adsorbing Contaminants in Hermetic Packages
Offering complex geometries and materials for attaching electronic circuitry and packaging electronic devices
Dissipating Heat from Sensitive Electronics
Extensive Metal Piece Part Solutions for Microelectronics
State-of-the-art laser welding facilities ensure connectors are efficiently integrated into housings for long-term hermetic reliability.
Offering world-class laser systems for glovebox hermetic sealing and laser welding, cutting and drilling services.
Our bonded metal technology uses an explosive charge to permanently join otherwise incompatible metals such as aluminum and stainless steel.