Hi-Rel: Enabling Components

Hi-Rel: Precision Microelectronics Components


Seals hermetic packages; getter may be attached to the lid

Getter Solutions

Prevents build-up of unwanted contaminants, ensuring a robust hermetic environment

Solder & Braze Preforms

Aids in attaching electronic circuitry and packaging electronic devices

Thermal Spreaders

Dissipates heat from a microelectronic chip or substrate

Ring Frames

Becomes integral side walls of a hermetic package, creating environmental separation

Application expertise and manufacturing capabilities  across three facilities enable Hi-Rel to continually meet its customers’ evolving needs.

Enabling Component Capabilities

Established reputation as a problem solver, attracting customers with manufacturing challenges
Manufacturing processes are maintained in-house, enabling the Company to operate effectively in running prototypes, niche product lines and large volume work
Comprehensive capabilities and unique materials expertise
Alloy Rolling
Alloy Rolling
Stamping & In-house Tooling
EDM Processing
Getter Dispensing
Getter Dispensing
Chemical Etching
Design & Prototype

Excellent Culture

55,000 combined sq. ft. (Essex,
Connecticut, USA; Ontario,
Canada; Norfolk, UK)

ISO 9001:2008 and
AS9100 Certified

© 2017 Hermetic Solutions Group