Brian Martinik joins HSG as IT Director
TINTON FALLS, NJ – February 22, 2018
Hermetic Solutions Group, a leading manufacturer of hermetic packaging, components and services announced the hiring of Brian Martinik as Director of IT for the corporation.
“We are pleased to announce that a critical new member has joined our team – Brian Martinik,” said William Hubbard, Hermetic Solution Group’s CEO. “Brian comes to us with deep experience as a technology executive across multiple industries and many years supporting our Hi-Rel division as our external IT partner. His strong emphasis on customer service will be a great addition as we strive to serve our growing customer base more efficiently. Initially, Brian will help develop and drive our IT strategy, including cyber security efforts, a new company-wide ERP implementation, and other programs that will leverage technology to meet the evolving needs of our customers.”
Brian joins Hermetic Solutions Group with over 20 years of successive experience in information technology, most recently at Axiom Network Designs where he was an owner and Vice President. Brian’s familiarity with the IT needs of Hi-Rel Group along with his experience developing technology solutions across multiple industries, will allow for an immediate assimilation into larger Hermetic Solutions Group, where he already has established relationships with each of the divisions and an understanding of their business needs and the needs of our customers. With an A.S. in Biomedical Engineering Technology, Brian’s education and the expertise as a successful IT professional will help drive our company forward.
The newly formed corporate IT Department will report through CFO Bill Sommers’ team and Brian will be located at the Hi-Rel Products facility in Essex, Connecticut and can be reached at firstname.lastname@example.org.
Hermetic Solutions Group was created in 2016 when three of the leading microelectronic packaging companies – Hi-Rel Group, Litron and PA&E merged to offer a single source of supply for hermetic packages, connectors, lids, thermal management spreaders, preforms, integration/sealing and laser solutions.