The Hermetic Solutions Group’s hermetic Nano-D connectors (.025" contact pitch) are compatible with lightweight materials like aluminum and titanium, as well as conventional iron/nickel alloys. They are used in defense, aerospace, and commercial applications where harsh environmental conditions necessitate an extremely rugged and reliable hermetic seal. The unique controlled CTE characteristics, chemical bonding properties and polycrystalline structure of Kryoflex, allow the Hermetic Solutions Group to manufacture this part with a 304L stainless steel shell and gold-plated contacts for excellent electrical performance and environmental characteristics. These hermetic connectors are designed for both laser-weld and solder-in applications.
The Hermetic Solutions Group’s hermetic Nano-D connectors are manufactured to exceed the requirements of MIL-DTL-32139.
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Hermetic Nano-D Connectors: Specifications and Testing Configuration
|Specifications||Material Compatibility||Designed for Aluminum, Titanium or Iron/Nickel Alloy Applications|
|Contact Material||303 Stainless Steel/Inconel X-750|
|Shell Finish Options||Passivated, Nickel/Gold Plated or Chromate Conversion Coated as applicable|
|Contact Finish||Nickel/Gold Plating|
|No. of Contacts||9,15,21,25,31,37,51|
|Opt. Solder Cup||Contact Us|
|Performance||Leak Rate||Less than 1×10-9 cc/sec Helium at 1 atmospheric differential pressure|
|Thermal Cycling||Tested to 500 (minimum) thermal cycles without hermetic performance loss|
|Insulation Resistance||Connectors provide greater than 5,000 Megohms at 500 VDC when tested in IAW MIL-STD-1344, Method 3003|
|Dielectric Withstanding Voltage||Connectors exhibit no evidence of breakdown or flashover when tested in IAW MIL-STD-1344, Method 3003|
|Corrosion||Connectors meet salt spray test in IAW MIL-STD-1344, Method 3003|
|Operating Temperature||-65°C to 200°C|